Custom Molded Cables Designed for Your Application I Mekoprint

Custom molded cables designed for your application

Using high-quality materials and precision molding technologies, molded cables are built to offer strong protection against mechanical stress, moisture, and environmental factors, maintaining reliability and functionality over time.

Low-pressure injection moulding and high-pressure injection moulding are two manufacturing processes used for different applications and materials. The choice of technology depend on needed properties in the final product.

Low-pressure injection moulding is suited for encapsulating electronics with thermoplastic polyamide materials at lower pressures and temperatures, while high-pressure injection molding is ideal for forming thermoset materials into complex shapes with high strength and precision.

Low-pressure injection moulding

Materials

This process uses Technomelt (formerly also known as Macromelt), a sustainable, cost-effective, and environmentally friendly thermoplastic polyamide material known for its electrical insulation and chemical neutrality. It's composed of 80% renewable raw materials and complies with UL, RoHS, and REACH standards.

Process

Suited for delicate electronic components, low-pressure molding encapsulates parts without excessive pressure or heat, minimizing damage risks. This technology, utilizing pressures below 100 psi and temperatures between 170°C to 240°C, allows for creating custom connectors and protective features.

The use of aluminum tools in the injection molding process offers a cost-effective alternative to conventional tools.

The method is also useful for achieving IP ratings or creating reliefs that enhance the functionality and integration of the cables into various applications.

High-pressure injection moulding

Materials

This method accommodates various thermoset materials like TPE, TPU, and PVC-COMPOUND, each offering unique properties like mechanical strength and chemical resistance. Options like PBT can be reinforced with fiberglass, ABS, or PVC for enhanced performance.

The materials will be carefully selected to achieve the right combination of properties, such as temperature sensitivity, flexibility, resistance, adhesion, and colour.

Process

Ideal for producing detailed and complex shapes, high-pressure molding fully seals electronic components, protecting against water, moisture, dust, and heat. The process involves high pressure and temperature to achieve complex designs with precise features and tight tolerances, leaving a high-quality surface finish.

The injection process ensures excellent surface finish and texture on moulded parts, minimising the need for secondary finishing operations and enhancing the aesthetic appeal of the final product.